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研究了环氧树脂粘合剂的热氧老化行为,并用热失重分析仪(TG)和傅立叶红外光谱仪(FTIR)分析了其热氧老化的机理。结果表明,环氧胶接接头的剪切强度随着老化时间的增加,呈现出先增加后下降的趋势,并且其下降幅度随老化温度的增加而增大;在较低温度条件下粘合剂的失重是由脱湿或试样中低分子物的挥发造成的,而在较高温度条件下,粘合剂的失重主要是由老化过程中粘合剂分解产生的低分子量挥发物造成的;空气中的氧气是影响粘合剂热降解的重要因素。
The thermal aging behavior of epoxy adhesive was studied. The mechanism of thermo-oxidative aging was analyzed by TG and FTIR. The results showed that the shear strength of the epoxy adhesive joint increased first and then decreased with the increase of the aging time, and the decreasing extent of the epoxy adhesive joint increased with the aging temperature. At lower temperature, Weight loss is caused by dewetting or the volatilization of low molecular weight components in the sample, whereas at higher temperature conditions, the weight loss of the adhesive is mainly caused by the low molecular weight volatiles resulting from the decomposition of the binder during the aging process; air Oxygen in the binder is an important factor in thermal degradation.