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三、封装对装在HF-28、HF-46和载体/封装三种封装结构中的晶体管作了估价。这三种样品都是带状线器件。为了选择输入、输出线的金属化尺寸以便调节它们从而获得最佳性能,管芯载体的原始样品没有进行密封。管芯载体的最后封装可获得和密封的HF-28、HF-46管壳具有同样的气密性。管芯载体的原始样品示于图5,它是由350×350×55密耳的BeO衬底组成的,其中心有一个集电极岛。在封装样品中输入和输出引线由Al_2O_3
Third, the package Installed in HF-28, HF-46 and carrier / package three kinds of package structure of the transistor made a valuation. All three samples are stripline devices. In order to select the metallization dimensions of the input and output wires in order to adjust them for best performance, the original sample of the die carrier was not sealed. The final package of the die carrier achieves the same air tightness as the sealed HF-28, HF-46 package. The original sample of the die carrier is shown in FIG. 5, which consists of a 350 × 350 × 55 mil BeO substrate with a collector island in the center. Input and output leads in package samples consist of Al 2 O 3